AOI Technology with shadow-free 3D Measurements

The first OptiCon Advanced Line 3D was presented at the 2014 SMT/Hybrid/Packaging show.
The telecentric measuring procedure for 3-dimensional detection of components and solder joints is a significant technology leap in terms of area-wide height measurement.
Well-known disadvantages of conventional 3D methods, such as shadowing problems caused by high components, are now eliminated.

The new sensor module called "3D EyeZ" is based on a Telecentric Multi Spot Array (TMSA), that measures the height of assemblies and solder joints by movable scanning.

Because of the orthogonal and telecentric projection and viewing direction, the measurements are absolutely error-free even in the most narrow gaps measurements of components. In addition, this technology eliminates the influence of component-, solder joints- and PCB surface-properties.

The new 3D-sensor combines the standard 2D inspection tasks with the 3D measurements such as solder volume, wetting angle, height and coplanarity.
Further outstanding features of 3D EyeZ are the freely selectable X/Y resolution as well as a high measurement speed of up to 70cm²/s.

3D EyeZ is available for integration in both in-line (AdvandedLine and TurboLine) as in the stand-alone (BasicLine) Goepel AOI system.

Contact Accelonix for more information on AOI technology.