600 Series bond test instruments

The Royce 600 Series of bond test instruments includes the Royce 650 Universal Bond Tester as well as the new Royce 620 Multitest Bond Tester, and the Royce 610 Dedicated Wire Pull Bond Tester.

Royce Instruments bond testers handle a wide variety of chip and wire testing applications.

Capabilities include:

• Wire bond pull test
• Ball bond shear test
• Solder ball shear test
• Solder ball pull test
• Die bond shear test
• Zone shear test
• 3 point die strength test

The Royce test instruments feature:

• Outstanding accuracy and durability – Even at high force levels there is virtually no deflection in the tool, due to the extreme rigidity of the robust frame design.
• Unparalleled data management capabilities – All Royce 600 Series instruments are linked to a centralized database, test data can be shared across your network and can be centrally managed. You can even access test data without leaving your desk or entering the cleanroom by using the desktop version of the Bond Test Manager software.
• Configuration flexibility – The Royce 600 Series instruments use interchangeable tooling, for cost savings and greater flexibility.
• Scalability – The networked system of Royce 600 Series instruments can easily be expanded to meet your growing needs.
• Responsive local support – Through authorized, highly trained local distributors, who are able to respond quickly to your needs.

Please contact Accelonix for further information on bond test instruments.