Computer-on-Module
equipped with the high-end dual chip versions
Beschrijving
Congatec extends its COM Express Basic portfolio with the new high-performance conga-TS175 Computer-on-Module. Equipped with the high-end dual chip versions of the brand new Intel® Xeon® and Gen 7 Intel® Core™ processors (codename Kaby Lake), it sets a new benchmark for module-based high-end embedded computers and modular industrial workstations that need to process massive workloads. Application areas for these high-end COM Express Type 6 Server-on-Modules can be found everywhere where data intensive streams need to be processed and displayed in real time.
Features:
- 7th Generation Intel® Core™ processor
- Intel® Xeon® processors for data center applications
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- ECC memory support
- Up to 32 GByte dual channel DDR4 memory
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