DDR3 8Gbit component based memory modules

As the DRAM market makes a steady migration to DDR4 memory, several key manufacturers have already announced end-of-life (EOL) production of DDR3 modules based on high density DDR3 8 Gbit components including EOL notice of the components. However, a sizable number of customers in the networking and embedded industries are still unable to shift to the latest generation and continue to use legacy systems requiring specific DDR3 memory such as VLP RDIMMs or high-density SO-DIMMs. To avert a supply shortage that could adversely affect these customers’ business operations, ATP has decided to provide its own DDR3 8 Gbit components for these modules.

• ATP-Built, Characterized and Tested from IC to Module
• 100% test during burn-in (TDBI)
• Available in monolithic 8 Gb one-chip select (1CS)
• Available in 8 Gb DDP two-chip select (2CS)
• Longevity Support