Fully Automatic Fine Pitch Heavy Wire Bonders

The Bondjet BJ93X Heavy Wire Bonders feature a heavy wire bond head with integrated pull test and large table travel (305 mm x 410 mm) that meets automotive electronics and power semiconductor requirements. They are also the fastest heavy wire bonders available today.
The Heavy Wire Bonders handle aluminum, gold and copper heavy round wire and ribbon wire at speeds of 3 wires/sec. The patented PiQC Process Integrated Quality Control analyzes 5 critical measurements of bond quality in real time for every bond, ensuring that only reliable, high quality devices are produced.

The recently introduced Bondjet BJ931L Fully Automatic Dual-Head Wedge Bonder enables simultaneous bonding of thin and heavy wire or ribbon for lead frame and matrix power semiconductor applications such as transistor outline (TO) packages and similar discrete devices with low pin counts.

The Bondjet BJ931L offers:

Small 1650 mm x 1200 mm footprint

Highest throughput on the market - up to 4500 UPH dependent upon application

Flexibility - Interchangeable bond heads for heavy wire, thin wire, ribbon wire and copper wire

Patented PiQCTM analyzes each bond in real time to ensure the quality of every device

E-BoxTM optical tool adjustment