Viscom 3D AXI X7058 In line X-Ray Inspection

Ultra-fast, in-line-capable automatic 3D X-ray inspection of electronic assemblies: the entire electronic assembly is 100 percent 3D-inspected. Viscom presents a completely new development in the area of in-line-capable X-ray inspection. The new system is of particular interest for companies which need to produce and inspect complex, high-value electronic assemblies at the highest quality efficiently and at low cost. The system will be presented to the public for the first time at Productronica 2015 (A2-177)

During the 100% top and bottom side 3D inspection, each detail of the entire electronic assembly is scanned several times by high-power line scanning cameras. The heart of the X-ray technology is the high-performance sealed microfocus X-ray tube with up to 130 kV/390 µA. The 3D reconstruction is performed on the basis of planar computed tomography.

The particular advantage for efficiency is the fast, reliable multi-level inspection in just one inspection process. The system features an automatic separation of top and bottom sides through the software (Placement Level Separation). Without this feature, during X-ray penetration the components on the top and bottom sides would cover each other to make reliable defect detection impossible. Thus, multilayer electronic assemblies assembled on both sides can be inspected for all typical SMD defects