X-ray ... which one for me?

Technical Article:

In SMD production, in addition to solder paste inspection (SPI) and automatic optical inspection (AOI), manual X-ray inspection MXI (off-line) and automatic X-ray inspection AXI (in-line) are also employed for quality control of electronic assemblies. In the process, 3D features deliver important information for quality assurance not only for SPI and AOI, but also for MXI and AXI. Different concepts of the 3D technology are available in the X-ray technology. To assess the different inspection concepts, it is expedient to take note of various boundary conditions and to define goals for the inspection.

Which inspection should be employed: 2D, „2.5D“, or 3D technology? In-line or offline? Random sample or 100 % inspection? In any case, it is helpful to be clear about what inspection coverage is needed, to then develop an appropriate overall concept in a comparison of the available technologies